TY  - BOOK
AU  - Brand, Oliver, editor. 
AU  - Fedder, Gary K., editor. 
AU  - Hierold, Christofer, editor. 
AU  - Korvink, Jan G., editor. 
AU  - Tabata, Osamu, editor. 
TI  - Enabling technologies for MEMS and nanodevices: advanced micro and nanosystems 
T2  - Advanced micro and nanosystems, 1
SN  - 9783527334988
AV  - CIR TK 875 E53 2013
PY  - 2013///
CY  - Weinheim
PB  - Wiley-VCH
KW  - Microelectromechanical systems.
KW  - Microelectronics.
KW  - Nanotechnology.
N1  - Includes bibliographical references and index; Advanced Micro & Nanosystems Volume 1 Enabling Technology for MEMS and Nanodevices; Preface; Contents; List of Contributors; 1 M3: the Third Dimension of Silicon; 2 Trends in MEMS Commercialization; 3 Capacitive Interfaces for MEMS; 4 Packaging of Advanced Micro- and Nanosystems; 5 High-frequency Integrated Microelectromechanical Resonators and Filters; 6 MEMS in Mass Storage Systems; 7 Scanning Micro- and Nanoprobes for Electrochemical Imaging; 8 Nanofluidic Modeling and Simulation; 9 Nanofluidics
Structures and Devices; 10 Carbon Nanotubes and Sensors: a Review

N2  - This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. A close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefi ts of three-dimensional silicon processing. An insider's view of industrial MEMS commercialization is followed by chapters on capacitive interfaces for MEMS, packaging issues of micro- and nanosystems, MEMS contributions to high frequency integrated resonators and filters, and the uses of MEMS in mass data storage and electrochemical imaging by means of scann

ER  -